Targeting next-generation wearables and space-constrained IoT applications, the nRF52832 Wafer Level Chip Scale Package (WL-CSP) has a super-compact 3.0 by 3.2mm footprint that occupies one quarter of the footprint area of Nordic’s standard 6.0 by 6.0mm QFN48-packaged nRF52832, yet offers the same full feature set
Nordic Semiconductor today announces the availability of a Wafer Level Chip Scale Package (WL-CSP) variant of its nRF52832 Bluetooth® low energy (formerly known as Bluetooth Smart) System-on-Chip (SoC) that occupies a quarter of the footprint area of the standard-packaged Nordic nRF52832 and targets next-generation, high-performance wearables and space-constrained IoT applications.
The nRF52832 WL-CSP has a super-compact 3.0 by 3.2mm footprint compared to the standard 6.0 by 6.0mm footprint of its larger but conventionally-packaged nRF52832 QFN48 cousin, yet offers the same full single-chip feature set and best-in-class, ultra-low-power application operation. This includes a powerful on-board 64MHz ARM® Cortex®-M4F processor that enables protocol and application task processing to be completed in unprecedentedly short time-frames, thus allowing power-saving sleep modes to be entered much quickly compared to competing devices.
Like the nRF52832, the nRF52832 WL-CSP features: 512kB Flash and 64kB RAM; on-chip NFC™ tag for consumer-friendly Touch-to-Pair; best-in-class ultra-high performance, ultra-low-power multi-protocol Bluetooth low energy, ANT™, and proprietary 2.4GHz radio; 5.5mA peak RX/TX currents; an on-chip RF Balun; plus a unique fully-automatic power management system that makes achieving optimal power consumption easy for designers.
The nRF52832 WL-CSP is compatible with Nordic’s Bluetooth 4.2 stacks and supporting SDKs including the latest S132 multi-role concurrent software stack, nRF5 SDK, nRF5 SDK for HomeKit, and nRF5 SDK for AirFuel (resonant wireless charging).
“The availability of a super-compact footprint nRF52832 brings new design opportunities to wearables and other space-constrained IoT applications,” comments Kjetil Holstad, Product Manager Ultra Low-Power Wireless at Nordic Semiconductor. “And this SoC is available now in high production volumes for immediate inclusion in upcoming product development.”
Holstad adds: “The evolution of wearables to date has only ever gone one way: ever increasing performance and functionality in ever-slimmer, lighter, form factors. The nRF52832 WL-CSP is by a clear margin, the smallest and most advanced Bluetooth low energy SoC available on the market today.”
The nRF52832 WL-CSP is available now for volume production.