RAKwireless RAK3172-F Module for LoRaWAN® with External Flash

Ultra-low-power module for LoRaWAN with extra flash and rollback recovery

RAK3172-F is here.

RAKWireless latest module for LoRaWAN® adds 512 KB external flash, enabling FUOTA-ready architectures and rollback-oriented firmware recovery for safer remote firmware updates.

Designed as a pin-compatible upgrade from RAK3172, RAK3172-F helps developers move faster from existing designs to long-term, maintainable IoT deployments.

Highlights:

• 512 KB Flash
• FUOTA Ready
• Pin-Compatible
• Ultra-Low Power
• LoRaWAN® + LoRa P2P

Built for remote monitoring, industrial telemetry, smart agriculture, environmental sensing, and battery-powered IoT applications.

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What is the RAK3172-F Module for LoRaWAN with External Flash?

The RAK3172-F Module for LoRaWAN with external flash is a low-power module for LoRaWAN that ensures safer rollback-based firmware updates. It combines LoRa® radio functionality and MCU processing in a single module while preserving the same footprint and pinout as the earlier RAK3172 design.

A key difference is the added external flash, which allows FUOTA-ready architectures and dual-image rollback strategies for safer remote firmware management. This reduces maintenance effort for devices deployed across difficult-to-access locations.

Quick Technical Overview

Item	Details
MCU	STM32WLE5JC (ARM Cortex-M4)
LoRaWAN	v1.0.4 Class A/B/C
Communication Modes	LoRaWAN and LoRa P2P
External Flash	512 KB
Sleep Current	Typical 2.2 µA
Interfaces	UART, SPI, I2C, GPIO, ADC
Development Options	AT Commands, RUI3 API
Activation Methods	OTAA / ABP

Why Use FUOTA-Ready LoRaWAN Hardware?

RAK3172-F reduces the risk of failed OTA updates by using external flash memory to store and validate new firmware before activation.

Standard OTA updates often replace firmware directly during installation. If an update fails due to weak signals, unstable power, or interrupted connections, remote devices may stop working and require physical maintenance.

RAK3172 vs RAK3172-F: What Changed?

Feature	RAK3172	RAK3172-F
External Flash	No	Yes
FUOTA Ready	Basic	Improved
Rollback Firmware Strategy	Limited	Supported
PCB Compatibility	—	Pin-compatible
Migration Effort	—	Minimal
Remote Update Reliability	Moderate	Improved
Long-Term Maintenance Focus	Moderate	Strong

LoRaWAN vs LoRa P2P: Which Should You Use?

LoRaWAN is best for managed cloud-connected networks, while LoRa P2P is better for direct device-to-device communication.

RAK3172-F supports both LoRaWAN and LoRa P2P communication, giving developers flexibility to build either cloud-connected IoT systems or private long-range wireless networks using the same hardware platform.

Key Features

Feature	Description
Pin-compatible RAK3172 upgrade path	Reuse existing RAK3172 PCB layouts with minimal redesign effort.
Extra external flash for FUOTA	Supports safer remote firmware updates and rollback-oriented recovery workflows.
Ultra-low-power operation	Designed for long-life battery-powered IoT deployments and remote field devices.
Integrated LoRa radio + MCU	Combines wireless communication and processing in a compact embedded architecture.
LoRaWAN Class A/B/C support	Supports standard LoRaWAN operation with OTAA and ABP activation methods.
LoRa P2P communication	Enables direct device-to-device wireless communication without LoRaWAN infrastructure.
Compatible with major LoRaWAN servers	Works with TTN, ChirpStack, Actility, and private LoRaWAN deployments.
AT command interface	Simplifies evaluation, integration, and rapid prototyping workflows.
Arduino development support via RUI3	Supports custom firmware development using Arduino-compatible APIs.
Suitable for remote IoT deployments	Designed for industrial telemetry, environmental monitoring, smart agriculture, and asset tracking systems.

Deployment Considerations for Battery-Powered IoT Devices

Battery life depends on communication frequency, device class selection, and firmware update behavior, not only sleep current.

Among the LoRaWAN device classes, Class A is typically the most energy-efficient. Devices remain in a low-power sleep state for the majority of the time, only briefly opening two short receive windows immediately after transmitting an uplink.

Compatible LoRaWAN Ecosystems and Servers

RAK3172-F works with public and private LoRaWAN networks, including:

• The Things Network (TTN)
• ChirpStack
• Actility
• Private LoRaWAN servers
• Custom LoRaWAN infrastructures

This allows developers to move from prototyping to production without changing hardware.

Typical Development Workflow

This workflow helps simplify migration from prototyping toward long-term deployment validation.

1. Configure the module using AT commands or RUI3 APIs
2. Validate LoRaWAN joins through TTN or private servers
3. Test payload transmission and power behavior
4. Configure FUOTA and rollback handling strategies
5. Validate RF performance and deployment stability
6. Deploy firmware updates remotely during field operation

RF Deployment and Antenna Considerations

Communication reliability depends on antenna selection, enclosure design, gateway placement, and local RF conditions. Proper antenna matching and network planning help improve packet delivery while reducing unnecessary retransmissions and power consumption.

Engineering Validation

The following examples illustrate deployment behaviors observed during evaluation and field testing.

Validation Area	Result
Sleep Current	Typical sleep current of 2.2 µA for low-power operation
FUOTA Recovery Testing	3 rollback recovery trials completed successfully during firmware update validation
Packet Delivery Validation	Delivery success improved from 82% to 97% during field telemetry testing
Firmware Maintenance	Service visits reduced by 41% after remote update deployment
Deployment Scale Tested	120 installed telemetry nodes validated during field evaluation

Get in touch for orders or any queries: sales@rfdesign.co.za / +27 21 555 8400

Courtesy of RAKwireless