X-Band Surface Mount (SMT) Circulator with low Insertion Loss and Small Package

May 23, 2016 – Tampa, FL – Smiths Microwave Subsystems is pleased to announce the release of the TRAK XBand Surface Mount (SMT) Circulator. This device is a low-cost, true SMT circulator compatible with tape-andreel (pick-and-place) and standard solder reflow profiles. It is designed to replace “drop-in” and microstrip style circulators. This unit provides a 10% bandwidth at X-Band, a minimum of 20 dB isolation, and 0.45 dB maximum insertion loss. Offering up to 20wcw of power handling in a 0.25” square by 0.066” high package, and an operating temperature of -40oC to +85oC, these circulators offer high performance with minimal impact on real estate. They greatly reduce costs by eliminating custom mounting configurations required with other circulator styles and install onto your CCA/PWB exactly the same as other SMT components. These innovative circulators are optimal for phased array Radar antennas as well as EW and Communications systems applications.

Coming soon is an (X-Band) 30% bandwidth version in a 0.35” square package, and a new S-Band device in a 0.75” square package.

About TRAK Microwave Corporation

TRAK Microwave Corporation is an advanced RF and Digital technology company that designs and manufactures a diverse range of RF and Microwave assemblies, subsystems, components, and Precise Time and Frequency systems for high performance defense, space and commercial applications worldwide. TRAK is ISO 9001 and AS9100C registered. For more information visit:


About Smiths Microwave Subsystems 

Smiths Microwave Subsystems is a business unit of Smiths Interconnect (www.smithsinterconnect.com) and includes TRAK, Millitech, and TECOM. The collective brands offer a strong heritage in customized and standard RF through millimeter-wave subsystems, frequency and timing systems, and antennas to defense and commercial customers. The Subsystems team specializes in the design, development and manufacture of customer-driven solutions including board-level components, RF assemblies, highly integrated subsystems, antennas and build-to-print manufacturing and testing.

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