New Planar X Series

Smiths Interconnect Introducing the New Planar X Series

Smiths Interconnect Introducing the New Planar X Series

Board Level Ceramic Based Thick Film RF Filters

Our new Planar X Series is part of an overarching initiative that entails the creation of best-in-class planar RF filter solutions designed and tested to support various applications and markets. Planar X Series compliments our broad portfolio of RF/Microwave components with bandpass, bandstop, lowpass and highpass configurations up to 18 GHz (Ku Band).

With the Planar X Series Smiths Interconnect leverages existing thick film process technology on various dielectric substrates which are designed for use in harsh high-reliability environments. The small footprint, light weight and surface mountable configuration allow for high volume pick and place applications and are ideal for SATCOM, Radar and Broadcasting industries.

Features & Benefits

  • Small Footprint – Reduced PCB Footprint
  • Light Weight – Reducing overall system mass in critical space applications
  • Excellent Rejection Characteristics – Providing best in class RF performance
  • Surface Mountable – Ideal solutions for Pick and Place Applications
  • Robust Materials – Suitable for Harsh Environment
  • Frequency Offerings up to 18 GHz – Suitable for a wide array of applications


  • Space
  • Aerospace
  • Defense
  • Medical
  • Broadcasting

Product Details


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