Marki Microwave NEW High Frequency, Compact Chip Scale Packaging Platform
Chip Scale Packaging Technology from Marki Microwave
High Frequency Operation in an Ultra-Compact Form
Marki Microwave’s patent pending chip scale packaging (CSP) platform provides superior performance in an ultra-compact form, enabling high frequency operation, improved electrical performance, and low unit-to-unit variation while optimizing SWaP-C.
Marki Microwave’s unique approach to CSP technology for GaAs MMIC products can be leveraged across all of the company’s product categories, enabling die-like size and performance with the ease of use of a surface mount product and standard surface mount assembly processes.
New Product Highlight
Family of GaAs MMIC-Based Equalizers and Attenuators Designed Using CSP Technology. Built for superior GaAs MMIC performance, the ATN10-0050CSP1, MEQ6-26CSP1, and MEQ10-45CSP1 are the newest additions to Marki Microwave’s portfolio of performance shattering products. Using CSP technology, their compact 1.5 x 1.5 mm design allows for extreme miniaturization of the surface mount footprint.
ATN10-0050CSP1
- 10dB attenuation from DC to 50GHz
- 22dB typical return loss over band
- 1W power handling
- Airborne, SWaP-C, and high channel count systems
MEQ6-26CSP1
- Positive gain slope from DC to 26GHz
- DC attenuation of 6dB
- Provides consistent unit-to-unit repeatability
- Microwave and high-speed digital systems
MEQ10-45CSP1
- DC attenuation of 10dB
- Typical insertion loss of 0.7dB at 45GHz
- VSWR of 1.5 over the entire band
- High speed data, telecom, and amplifier compensation
Courtesy of Marki Microwave
