ROGERS RO4450T PREPREG, 3mil, DK=3.23 ±0.05, 12″x18″

RO4400™ Series Bondply

RO4000® dielectric materials have long been used in combination with FR-4 cores and prepreg as a means to achieve a performance upgrade of standard FR-4 multi-layer designs. RO4003C™, RO4350B™ , and RO4000 LoPro™ glass reinforced hydrocarbon/ceramic laminates have been used in layers where RF / microwave frequency, dielectric constant, or high-speed signal requirements dictate high performance materials. FR-4 cores and prepreg are still commonly used to inexpensively form less critical signal layers.

The RO4400™ prepreg family is comprised of grades based on the RO4000 series core materials, and are compatible in multi-layer constructions with either RO4003C, RO4350B, RO4835™, RO4360G2™ or RO4000 LoPro laminates.

Benefits

• High frequency thermoset prepreg compatible with FR-4 bond temperatures
• Low z-axis expansion for high reliablility plated through holes
• Sequential lamination capable
• Lead free solder processing compatible

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