Nordic Semiconductor launches ultra-thin Bluetooth Smart solution for space-constrained smartcards and wearable applications.
Nordic Semiconductor today announces the availability of a Thin Wafer-Level Chip Scale Package (Thin WL-CSP) variant of its nRF51822 Bluetooth Smart Systems-on-Chip (SoC). Oslo, Norway 2016/04/13 The Thin WL-CSP nRF51822 is designed to address the needs of the fast-growing Bluetooth®connected payment and subscription smartcard market, as well as miniaturized wearables applications where the physical profiles…
