OSM vs. SMARC: Which Form Factor Is Right for Your Design? Choosing a compute module form factor is one of those decisions that feels like an implementation detail early in a project and becomes a structural constraint the moment you commit to a PCB layout. OSM (Open Standard Module) and SMARC (Smart Mobility ARChitecture) are...

What Devices Support Wi-Fi 7? Wi-Fi 7, formally known as IEEE 802.11be, is the latest generation of Wi-Fi technology. It delivers extremely high throughput (theoretical peaks up to tens of gigabits per second) along with improved capacity and low latency using features like 320 MHz ultra-wide channels, Multi-Link Operation (MLO), and 4096-QAM modulation. The Wi-Fi...

Industry Standard M.2 Footprints Explained What Every Engineer Needs to Know Before Designing In a Wi-Fi Module Some wireless module datasheets list an M.2 form factor and call it done. What they don't tell you is that "M.2" is not a single specification — it's a family of mechanical form factors, keying configurations, and interface...

Ezurio Sona™ IF573 vs. Sona™ IF513: Performance vs Low Power Wi-Fi 6E Module Selection: When Each Wins Picking a Wi-Fi 6E module by leading with the spec sheet is backwards. Engineers who start with "what does this radio support?" end up over-specifying battery-powered devices or under-specifying high-density infrastructure nodes and those mismatches surface in late-stage...

Precision Distance Measurement With Bluetooth Channel Sounding At Embedded World 2026, Ezurio's VP of Product Management Jonathan Kaye offered a keynote on the exciting technical case of Bluetooth Channel Sounding with multiple antenna support. It offers high-accuracy distance measurement for next-generation location and sensing applications. Understand how Bluetooth channel sounding improves distance accuracy See why...

BL5340PA Series RF Module by Ezurio The BL5340PA Series from Ezurio are Multi-Protocol Bluetooth + 802.15.4 + NFC Modules. They are advanced, high-performance modules designed to enable reduced development risk and faster time-to-market of multi-protocol wireless designs. These modules are based on Nordic Semiconductor’s nRF5340 SoC and nRF21540 front-end module, and consist of a dual-core ARM Cortex-M33...

Security Is All About Trust. The US Cyber Trust Mark Aims to Deliver It. A new US program attempts to provide a seal on IoT products that inspires trust in customers for products that meet the standard. Here’s what that looks like, and when it could come to electronics near you. An Urgent Problem for...

“It’s Just a Sensor, Right?” Ezurio Lessons Learned in Rugged, Reliable Sensor Design In electronic design, particularly in products that operate in challenging environments, every decision is a trade-off that affects everything else. Here’s what we learned developing Ezurio RS26x LoRaWAN temperature sensor. Building the Perfect Sensor – A Balanced Approach At The Things Conference...

Ezurio to Power the Edge with Carbon AM62: A Secure and Powerful OSM-MF SOM Based on TI AM62x SoC with Advanced Graphics and Built in TI CC3351 Wireless Connectivity Akron, Ohio – 10 February 2026 – Ezurio, a global leader in connectivity, today announces the Carbon AM62 OSM-MF System-on-Module (SOM) — a secure, rugged, and highly configurable platform...

Partnerships Combine – Ezurio’s Silicon Labs BT & LoRaWAN Modules + Zephyr Ezurio’s partnerships provide customers with more silicon options and flexible ways to bring innovations to life. Hardware and software collaborations now combine, resulting in stronger support for Zephyr on Silicon Labs-based modules. Flexible Options for Cutting-Edge Designs Ezurio supports designs with tools and...