Nordic Semiconductor-powered Bluetooth low energy modules ease development of Bluetooth 5 wireless solutions in ultra compact mHealth and wearables applications
Taiyo Yuden’s module employs the wafer level-chip scale package variant of Nordic’s nRF52832 SoC to meet the needs of developers of complex, space-constrained wireless products Oslo, Norway 2017/03/09 Nordic Semiconductor today announces that Tokyo, Japan-based electronic component and wireless module manufacturer, Taiyo Yuden, has selected Nordic’s nRF52832 Bluetooth® low energy System-on-Chip (SoC) for its EYSHSNZWZ…
