Pasternack Launches a New Comprehensive Product Line of Tunnel Diode Detectors Available with Same-Day Shipping
Pasternack Releases New Millimeter-wave Waveguide Antennas Up to 220 GHz
Updates on Millimeter-wave 5G (Part 2)
Pasternack Expands Line of Skew Matched Cable Pairs to Include 40 GHz and 67 GHz Models with Delay Match as Low as 1 ps
Pasternack Expands its Line of Custom Low-PIM Coaxial Cable Assemblies
Same-Day Delivery Offered for Standard and Custom Length Low-PIM Cables IRVINE, Calif. – Pasternack, an Infinite Electronics brand and a leading provider of RF, microwave and millimeter wave products, has expanded its offering of low-PIM coaxial cable assemblies to offer customers even more connector options to address DAS, wireless infrastructure, multi-carrier communication systems, WISP, small…
When DAS Meets PIM: On the Challenges of Accounting for PIM with Distributed Antenna Installations (Part 2)
In last week’s post, we covered foundational details regarding PIM in modern wide-band and multi-carrier communication systems, with a note on upcoming 5G NR sub-6 GHz frequencies being added to the mix. This week’s blog expands upon that discussion and provides more details of PIM considerations specific to DAS. With DAS, another large PIM concern is…
When DAS Meets PIM: On the Challenges of Accounting for PIM with Distributed Antenna Installations (Part 1)
Passive intermodulation distortion is the result of discontinuities, metal-to-metal contact, and material properties that lead to nonlinear characteristics of typically linear passive transmission lines and components. PIM can be induced in a variety of RF components, such as connectors, adapters, cable, combiners, splitters, couplers, tappers, attenuators, terminators, antennas, and cable-to-board interconnect. PIM is generated when…
The Making of Low PIM Coaxial Cable Assemblies
Courtesy of Pasternack : The Making of Low PIM Coaxial Cable Assemblies With the growing number of distributed antenna system (DAS) and small cell installations, low passive-intermodulation distortion (PIM) interconnect and components have gained popularity. Modern complex multi-carrier communication systems, such as DAS and small cells, are now incredibly wide-band and support a plethora of…
Benefits and Applications of Vertical Launch Solderless Connectors
Courtesy of Pasternack : Benefits and Applications of Vertical Launch Solderless Connectors Testing interconnect for upper microwave and millimeter-wave frequencies is intrinsically a challenge. The small geometries and extremely tight tolerances on geometries, conductor surfaces, and closely located differential signal traces place additional design burdens and create testing obstacles for high-speed data and telecommunications applications….








